JPH0415327Y2 - - Google Patents
Info
- Publication number
- JPH0415327Y2 JPH0415327Y2 JP1985021212U JP2121285U JPH0415327Y2 JP H0415327 Y2 JPH0415327 Y2 JP H0415327Y2 JP 1985021212 U JP1985021212 U JP 1985021212U JP 2121285 U JP2121285 U JP 2121285U JP H0415327 Y2 JPH0415327 Y2 JP H0415327Y2
- Authority
- JP
- Japan
- Prior art keywords
- liquid tank
- support
- cream solder
- mounting base
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 40
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 26
- 239000006071 cream Substances 0.000 description 25
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985021212U JPH0415327Y2 (en]) | 1985-02-15 | 1985-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985021212U JPH0415327Y2 (en]) | 1985-02-15 | 1985-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61139777U JPS61139777U (en]) | 1986-08-29 |
| JPH0415327Y2 true JPH0415327Y2 (en]) | 1992-04-07 |
Family
ID=30512403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985021212U Expired JPH0415327Y2 (en]) | 1985-02-15 | 1985-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415327Y2 (en]) |
-
1985
- 1985-02-15 JP JP1985021212U patent/JPH0415327Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61139777U (en]) | 1986-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1094420C (zh) | 网板印刷装置及网板印刷方法 | |
| CN110610884A (zh) | 一种镀膜芯片粘连装置 | |
| JPH0415327Y2 (en]) | ||
| CN116819810A (zh) | 一种基于视觉传感的et电测监测系统 | |
| CN113471789A (zh) | 用于线材沾锡的载具、包含该载具的沾锡装置及其沾锡工艺 | |
| CN201143504Y (zh) | Smd器件排列分选叠装装置 | |
| JP2932624B2 (ja) | クリーム半田のスクリーン印刷装置 | |
| KR20040042995A (ko) | 게터제 도포장치 | |
| CN208201116U (zh) | 一种真空镀膜机用基片翻转装置 | |
| CN210469927U (zh) | 一种电子零件安装装置 | |
| JPS6213838B2 (en]) | ||
| JP3303837B2 (ja) | スクリーン印刷装置及びスクリーン印刷方法 | |
| CN216670146U (zh) | 一种工控产品电气自动化检测台 | |
| JPH0522061U (ja) | ピン転写装置 | |
| CN117423648B (zh) | 一种散装芯片摇装装置 | |
| CN217478593U (zh) | 一种贴片校正辅助装置 | |
| CN117175322B (zh) | 一种连接器绝缘组件的自动粘接设备及方法 | |
| CN118723426B (zh) | 一种玻璃覆膜生产用搬运装置 | |
| JP2002106558A (ja) | リニアガイド及び電子部品装着装置 | |
| JPH0611529Y2 (ja) | 回路基板への塗布装置 | |
| JP3276504B2 (ja) | ダイボンディング装置 | |
| JP3303838B2 (ja) | スクリーン印刷装置及びスクリーン印刷方法 | |
| SU1443220A1 (ru) | Устройство дл групповой загрузки плоских деталей преимущественно в виде фланцев с буртиком | |
| SU963749A1 (ru) | Устройство дл нанесени па льной жидкости или других текучих веществ на детали | |
| CN115436776A (zh) | 一种集成电路芯片用测试装置 |